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Table Of Contents  CertiGuide to A+ (Core Hardware)
 9  Chapter 0011:  System Memory
      9  IV  RAM Packaging

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IV  RAM Packaging
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Single Inline Memory Module (SIMM)
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Dual Inline Package (DIP)

The first type of memory packaging that you will see is the Dual Inline Package, or DIP module. These are small plastic or ceramic packages that have a rectangular shape with a row of the pins running along both sides. Earlier PCs used DIPs in small amounts for its system memory. The DIPs were either soldered directly into the motherboard or were placed in sockets that were soldered into the motherboard. Both implementations have their disadvantages.

Figure 42: Two DIP chips.

 


When they were soldered directly into the motherboard, the user was unable to replace them should one of the DIPs go bad. When they were placed into the sockets it was too easy to bend the pins on the DIP when installing them. They were also prone to what is known as to chip creep. The heating and cooling of the system when it is powered on and off causes the chips to expanded and contract, which eventually works the chips out of their sockets. Because of these limitations, the industry began packaging chips on small circuit boards that could be inserted into a special socket on the motherboard.

Figure 43: DIP chips and sockets.

 


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IV  RAM Packaging
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Single Inline Memory Module (SIMM)
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